Czechs present their advances in nanotechnology at TechConnect World 2017

16 May. 2017 | CzechInvest | Two Czech inventions have received the TechConnect 2017 Innovation Award

TechConnect World

Eleven representatives of Czech organisations and firms have travelled to Washington, D.C., for the TechConnect World trade fair, which is being held from 14 to 17 May 2017. The members of the delegation will present their technologies at the annual event, which is attended by innovators, investors and government agencies from around the world, is focused on commercialisation of nanotechnologies.

The Czech Republic is presenting eleven Czech entities in the exhibition space. The exhibitors include the company Advanced Materials-JTJ, the Nano Association of the Czech Republic, AtomTrace, the Central European Institute of Technology, HE3DA, nanoSPACE, Nenovision, Mendel University in Brno, Pardam, SYNPO and the University of Pardubice – Centre of Materials and Nanotechnologies.

Deputy Minister of Foreign Affairs Milosvav Stašek visited the conference on Monday. Apart from other meetings the delegation had a chance to also meet with representatives from the Nanotechnology department of The Office of Science and Technology under the White House.

Two Czech inventions have received the TechConnect 2017 Innovation Award for the best registered technologies and will be given space for presentation. The award winners are Mendel University’s Selenbact, a veterinary product containing nanoparticles of selenium with antibacterial properties, and Pardam’s development and production of ceramic and organic nanofibers. During the event, the Centre of Materials and Nanotechnologies will present a new approach to synthesising biomolecules with the use of inorganic composite materials. 

CzechInvest and Czech Embassy in Washington, D.C. organised a national booth co-financed from the economic diplomacy project.

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